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Manufacturing Processes - Laser-beam machining (LBM)

 
Non-traditional Machining Processes

Abrasive Flow Machinging - (AFM)
Chemical Machining
Chemical Milling
Electrical Discharge Grinding (EDG)
Electrical Discharge Machining (EDM)
Electrochemical Discharge Grinding (ECDG)
Electrochemical Grinding (ECG)
Electrochemical Honing (ECH)
Electrochemical Machining (ECM)
Electrochemical Turning (ECT)

Electron Beam Machining (EBM)
Ion Beam Milling - (IBM)
Laser Beam Machining - (LBM)
Laser Cutting
Laser Drilling
Photochemical Machining - (PCM)
Plasma Arc Machining- (PAM)
Ultrasonic Machining
WaterJet Machining
AbrasiveJet Machining

 

Laser-beam machining -- LBM

Laser-beam machining (LBM) is accomplished by precisely manipulating a beam of coherent light to vaporize unwanted material. LBM is particularly suited to making accurately placed holes. It can be used to perform precision micromachining on all microelectronic substrates such as ceramic, silicon, diamond, and graphite. Examples of microelectronic micromachining include cutting, scribing & drilling all substrates, trimming any hybrid resistors, patterning displays of glass or plastic and trace cutting on semiconductor wafers and chips.


Applications -

The LBM process can make holes in refractory metals and ceramics and in very thin materials without warping the workpiece. The laser can scribe, drill, mark, and cut thin metals and ceramics, trim resistors, and process plastics, silicon, diamond, and graphite with tolerances to one micron.

 

 

 

Laser Beam Machining




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