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Laser-beam
machining -- LBM
Laser-beam machining (LBM)
is accomplished by precisely manipulating
a beam of coherent light to vaporize unwanted
material. LBM is particularly suited to
making accurately placed holes. It can be
used to perform precision micromachining
on all microelectronic substrates such as
ceramic, silicon, diamond, and graphite.
Examples of microelectronic micromachining
include cutting, scribing & drilling
all substrates, trimming any hybrid resistors,
patterning displays of glass or plastic
and trace cutting on semiconductor wafers
and chips.
Applications
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The LBM process can make holes in refractory
metals and ceramics and in very thin materials
without warping the workpiece. The laser
can scribe, drill, mark, and cut thin metals
and ceramics, trim resistors, and process
plastics, silicon, diamond, and graphite
with tolerances to one micron.
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